Materials Testing Services
Measurements of nanoscale and microscale thermal properties and complementary materials characterization.
Thermal Conductivity by Time-Domain Thermoreflectance (TDTR)
Non-contact measurement of thermal conductivity and interface thermal conductance in thin films and bulk solids. The technique accommodates materials spanning four orders of magnitude in thermal conductivity, from low-diffusivity polymers to single-crystal diamond.
Thermal Conductivity and CTE by D‑TOPS
Simultaneous determination of thermal conductivity and the linear coefficient of thermal expansion (CTE) using displacement thermo-optic phase spectroscopy (D-TOPS). The method evaluates small sample volumes, polymers, semiconductors, and metallic foils down to 10 µm in thickness.
Thermal Conductivity of Liquids by I‑TOPS
High-precision measurement of fluid thermal conductivity using immersion thermo-optic phase spectroscopy (I-TOPS). High-frequency optical modulation isolates purely conductive transport and eliminates buoyancy-driven convection in small liquid volumes.
Thermal Boundary Resistance (TBR) by I‑TOPS
Non-destructive measurement of thermal boundary resistance (TBR) across bonded interfaces and 3D integrated circuit die stacks. Immersion thermo-optic phase spectroscopy provides high phase sensitivity and extends the thermal probing depth up to ~100 µm.
Materials Analysis in Support of Thermal Testing
Independent structural and compositional characterization in support of thermal transport metrology, including picosecond acoustics for elastic constants, Rutherford backscattering spectrometry for stoichiometry, and X-ray reflectivity for layer density.