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Materials Characterization in Support of Thermal Property Measurements

Film thickness, elastic constants, vibrational spectroscopy, and composition.

Overview

Accurate thermal transport modeling requires accurate knowledge of film thickness and density. Interpretation of the results benefits from knowledge of elastic constants and microstructure.

Picosecond acoustics measures acoustic transit times to determine sound velocity and layer thickness. Ion beam analysis by Rutherford backscattering spectrometry (RBS) yields atomic composition and stoichiometry without empirical standards. X-ray reflectivity (XRR) and spectroscopic ellipsometry help establish density and thickness. Vibrational spectroscopy (Raman, FTIR) provides insight into chemical bonding and microstructure.

Complementary Characterization Suite

Picosecond Acoustics

Measures acoustic transit times, longitudinal sound velocities, and elastic moduli in sub-micron films.

Ion Beam Analysis (RBS)

Rutherford backscattering spectrometry evaluates elemental composition, stoichiometry, and interfacial interdiffusion without reference standards.

X-Ray Reflectivity (XRR)

Determines thin-film mass density, layer thickness (1–200 nm), and root-mean-square interface roughness.

Spectroscopic Ellipsometry

Characterizes dielectric film thickness and complex refractive index (n, k) across UV-visible-NIR wavelengths.

Request Materials Characterization

Incorporate materials characterization to improve the measurement and understanding thermal transport properties. Let us know your requirements and we will get back to you with a quote.