Providing accurate data for industrial and academic R&D.
Explore Our ServicesAccurate non-contact thermal conductivity measurements of thin films and small volumes of bulk materials using TDTR. Applicable to a wide range of materials spanning the entire range of thermal conductivity from polymers to diamond.
Simultaneous measurement of thermal conductivity and coefficient of thermal expansion (CTE) using our D‑TOPS implementation of photothermal displacement methods. Applicable to small volumes of polymers, semiconductors, and metals as thin as 10 microns.
Precise measurements of the thermal conductivity of small volumes of liquids by immersion thermo-optic phase spectroscopy (I‑TOPS), our implementation of a mirage technique.
Measurement of the thermal boundary resistance (TBR) of bonded interfaces and the assembly of dies into 3D integrated circuits. This approach uses immersion thermo-optic phase spectroscopy to achieve exceptionally high sensitivity and extend the probing depth to the order of 100 microns.
Complementary materials characterization services to support and enhance thermal conductivity data. Includes measurements of thickness and elastic constants by picosecond acoustics, composition by ion beam analysis, and thickness by x-ray reflectivity and ellipsometry to provide a complete understanding of the thermal conductivity of your materials.